A New Era of Chipmaking to Meet the World’s Demand for Compute
At Hot Chips 34, Intel highlights the latest architectural and packaging innovations enabling the 2.5D and 3D tile-based chip designs that will bring about a new era in chipmaking and propel Moore’s Law forward for years to come. In Intel’s first Hot Chips CEO keynote since Gordon Moore’s in 1995, Intel CEO Pat Gelsinger shared the company’s path for continuing its relentless pursuit of more powerful compute, providing details from across the company’s upcoming portfolio, including Meteor Lake, Ponte Vecchio GPU, Intel® Xeon® D-2700 and 1700, and FPGAs, and outlining its new systems foundry model.
The industry is entering a new golden age of semiconductors – an era in chipmaking that requires a shift from the traditional foundry model mindset to a systems foundry. Beyond supporting traditional wafer manufacturing, Intel’s systems foundry model incorporates advanced packaging, an open chiplet ecosystem and software components, to assemble and deliver systems in a package that meet the world’s insatiable demand for compute power and fully immersive digital experiences. Intel is also addressing industry demand with continued advances in process technology and tile-based design.
Intel previewed the following product architectures from next-generation technologies at Hot Chips 34:
- Meteor Lake, Arrow Lake and Lunar Lake processors will transform personal computers with tile-based chip designs that create efficiencies in manufacturing, power and performance.
- Intel Data Center GPU, code-named Ponte Vecchio, was built to address the compute density across high performance computing (HPC) and AI supercomputing workloads.
- Xeon D-2700 and 1700 series are designed to address edge use cases for 5G, IoT, enterprise and cloud applications, with special consideration to the power and space constraints that are common in many real-world implementations.
- FPGA technology continues to be a powerful and flexible tool for hardware acceleration, with particular promise for radio frequency (RF) applications.
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